Different SMD Component Package Sizes

Contents

Surface-mount devices are mounted directly to a PCB. These components are smaller than the through-hole components and comprise a small lead or no lead at all. Since SMD components require fewer drilled holes, they incorporate higher routing density and the design becomes more compact.

There are many SMD components of different package sizes with various functionalities. They can be placed on both sides of the circuit board along with a higher component density with more connections possible per component to attain higher speed. Here, we will briefly introduce some of them.

SMD package sizes for resistors, capacitors, inductors, and diodes

SMD passive components consist of resistors, capacitors, and inductors with a rectangular package. Diodes are also part of this but are two-terminal active devices. Diodes can be miniaturized and packaged according to the following SMD sizes.

Chip package typeDimensions in mmDimensions in inches 010050.4 x 0.20.016 x 0.008 0150150.38 x 0.380.014 x 0.014 02010.6 x 0.30.02 x 0.01 02020.5 x 0.50.019 x 0.019 024040.6 x1.00.02 x 0.03 03030.8 x 0.80.03 x 0.03 04021.0 x 0.50.04 x 0.02 06031.5 x 0.80.06 x 0.03 08052.0 x 1.30.08 x 0.05 10082.5 x 2.00.10 x 0.08 11112.8 x 2.80.11 x 0.11 12063.0 x 1.50.12 x 0.06 12103.2 x 2.50.125 x 0.10 18064.5 x 1.60.18 x 0.06 18084.5 x 2.00.18 x 0.07 18124.6 x 3.00.18 x 0.125 18254.5 x 6.40.18 x 0.25 20105.0 x 2.50.20 x 0.10 25126.3 x 3.20.25 x 0.125 27256.9 x 6.30.27 x 0.25 29207.4 x 5.10.29 x 0.20

Surface-mount PCB connectors

An electronic project is incomplete without a proper connector. In surface-mount technology, SMA and SMB connectors are mostly used for board assembly. SMA and SMB stand for sub-miniature version A and sub-miniature version B.

TypePropertiesApplication SMA1. Semi-precision
2. Coaxial RF connector
3. Impedance 50Ω
4. Electrical use from DC (0 GHz) to 12 GHz,
but extended to 18 GHz and 26.5 GHz1. Microwave systems
2. Hand-held radio
3. Mobile telephone antennas
4. WiFi antenna systems SMB1. Semi-precision
2. Coaxial RF connector
3. Impedance 50Ω or 75Ω
4. Electrical use from DC(0 GHz) to 4 GHz
5. Smaller than SMA1.Telecommunications
2. Test equipment
3. Instrumentation
4. GPS

 

Connector Design Guide

5 Chapters - 32 Pages - 50 Minute Read

What's Inside:

• Basics
• Terminology
• Selection and layout rules
• Testing
• Application-specific PCB connectors

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Common SMD Tantalum capacitor sizes

Tantalum capacitors do have very high capacitance with very small packaging. These capacitors give the best results in high-capacitance, low-current environments.

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Small outline transistor package types

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A small outline transistor is a discrete surface-mount transistor that is majorly used in consumer electronics. Here are some commonly used SOTs.

Package typeDimensions in mmTerminal SOT-233 × 1.75 × 1.33 SOT-2236.7 × 3.7 × 1.84 SOT-3232.1 x 2.1 x 0.94 SOT-5231.6 x 1.6 x 0.74

Other SMD transistors

We can see some popular SMD transistors other than SOT here.

TO-252-3 (DPAK)

 

TO-263

 

 

Integrated circuit SMD packages

ICs are enclosed in a package for protection. Here we will see some important IC packages, their properties, and applications.

Package type

PropertiesApplication SOIC1. Small outline integrated circuit
2. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package)1. Standard package for logic IC TSSOP1. Thin shrink small outline package
2. Rectangular surface mount
3. Plastic integrated circuit (IC) package
4. Gull-wing leads1. Analog amplifiers,
2. Controllers and Drivers
3. Logic devices
4. Memory devices
5. RF/Wireless
6. Disk drives QFP1. Quad flat package.
2. Easiest option for high pin-count components
3. Easy to inspect by AOI
4. Assembled with standard reflow soldering1. Microcontrollers
2. Multi-channel codecs QFN1. Quad flat no-lead
2. Electrical contacts do not come out of the component
3. Smaller than QFP
4. Require extra attention in PCB assembly1. Microcontrollers.
2. Multi-channel codecs PLCC1. Plastic leaded chip carrier
2. Allow components to be directly mounted on the PCB1. Prototype PCB assembly BGA1. Ball grid array
2. Most complex
3. High-pin count component
4. Electrical components are below silicon IC
5. Requires reflow soldering for PCB assembly1. High-speed microprocessor
2. Field programming gate array(FPGA) POP1. Package-on package technology
2. Stacked on the top of others1. Used for memory devices and microprocessors.
2. High-speed design, HDI design

SMD components ensure a smaller form factor design. The manufacturing cost is minimized and board space can be efficiently optimized by incorporating these components. Indeed, SMD packages are the better choice over through-hole components when designing a sleek, compact, high-speed, or HDI board.

SMT, sometimes are preferred over through-holes components for some reasons, such : 1. Space occupy on board 2. Ease of heat dissipation and 3. Speed of Functionality. However, in some circuits such as intensive heat generated categories, especially in power Electronics through-hole components are better. One of the way to ensure optimum performance of SMT in a circuit is to ensure that large heat sink are mounted to enhance adequate heat dissipation, fan could also be provided to ensure adequate cooling and heat extraction from the board. To ensure prolonged life span of SMT component Theta JA and Theta JC of components must be determined to ensure that such component operates within healthy conditions.